Over moulded speed sensor
Temperature sensors for exact and fast measurements
MCU for in-wheel-drive
High temperature detectors with integrated thermal element
Refractometer with integrated thermal element
LED modules for automotive headlights applications
Active accelerator pedal for haptic communication
Direction- and position detection on 3D contours
Inductive hight level sensor (IHLS)
Power module for electronically driven water pump
Differential pressure sensor
Electronic Control Unit / E-Mobility

TFC / TFS on Aluminium Nitride from AB Mikroelektronik

Flexibile patterning and conductor thicknesses enable high density integration for power substrates, thus signal as well as power electronics can be efficiently and cost effectively unified. Thick film processes allow for quick design changes and layout reviews.

 

Typical features and benefits

  • In comparison to DCB substrates, thick film substrates can easily vary conductor thicknesses allowing for small pitch patterning for signal electronics for effective control and high power electronic integration
  • Standard thicknesses between 30 µm - 300 µm, extended thickness up to 500 µm can be achieved when needed
  • Optimized material bond layers and the nature of sinter materials, lower stress between metal-ceramic interfaces are obtained improving thermal shock capabilities
  • Thick film is an additive and selective process
  • No under etch problems or design limitations due to etching process
  • Possible conductor tracks are copper and silver

More information about TFC / TFS on Aluminium Nitride:


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