Power Stack from AB Mikroelektronik

The Power Stack Technology is an electronic packaging architecture which enables double sided cooling for active semiconductor components. This brings a reduction in thermal resistance as well as an increase in power density (up to 30kW). Made with metal substrates and thick film dielectrics, a reliable, cost effective, light weight, small footprint power module is now possible.

Typical features and benefits

• Power module with double-sided cooling without wire-bond connections
• Optimised packaging concept for reducing parasitic inductance
• Reduction in thermal resistance due to a larger surface contact area
• Reduction in cost by removing expensive DCB substrates as well as heat spreading baseplates
• Light weight and small footprint

Special features:

• High temperatures possible by using ceramic substrates (up to 160 °C)
• High performances in a small installation space by chip & wire technology
• High vibration permitted, assembly to combustion engine possible
• Fully integrated into the electric motor by high integration density
• Customer specific design