Power Stack

The Power Stack Technology is an electronic packaging architecture which enables double sided cooling for active semiconductor components. This brings a reduction in thermal resistance as well as an increase in power density (up to 30kW). Made with metal substrates and thick film dielectrics, a reliable, cost effective, light weight, small footprint power module is now possible.


Typical features and benefits

  • Power module with double-sided cooling without wire-bond connections
  • Optimised packaging concept for reducing parasitic inductance
  • Reduction in thermal resistance due to a larger surface contact area
  • Reduction in cost by removing expensive DCB substrates as well as heat spreading baseplates
  • Light weight and small footprint


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Fast Facts


In the media: Power Stack technical article - Hanser Automotive - Emobility 10-2015 (German language)

Award-winning Technology
Power Stack technology has won VERENA-award 2015. AB Mikroelektronik developed the first to the market process for soldering of electronic components to Aluminum which makes Power Electronics for E-Drive much more eco-friendly and offers also a very high cost/efficiency benefit.


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