Power Stack from AB Mikroelektronik
The Power Stack Technology is an electronic packaging architecture which enables double sided cooling for active semiconductor components. This brings a reduction in thermal resistance as well as an increase in power density (up to 30kW). Made with metal substrates and thick film dielectrics, a reliable, cost effective, light weight, small footprint power module is now possible.
Typical features and benefits
- Power module with double-sided cooling without wire-bond connections
- Optimised packaging concept for reducing parasitic inductance
- Reduction in thermal resistance due to a larger surface contact area
- Reduction in cost by removing expensive DCB substrates as well as heat spreading baseplates
- Light weight and small footprint
Special features:
- High temperatures possible by using ceramic substrates (up to 160 °C)
- High performances in a small installation space by chip & wire technology
- High vibration permitted, assembly to combustion engine possible
- Fully integrated into the electric motor by high integration density
- Customer specific design
More information about Power Stack:
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